1. 2. 3. material content data sheet sales product name tlf50241el issued 28. august 2013 ma# MA001056010 package pg-ssop-14-3 weight* 82.97 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 1.797 2.17 2.17 21665 21665 leadframe inorganic material phosphorus 7723-14-0 0.009 0.01 104 non noble metal zinc 7440-66-6 0.034 0.04 415 non noble metal iron 7439-89-6 0.689 0.83 8305 non noble metal copper 7440-50-8 27.978 33.72 34.60 337221 346045 wire noble metal gold 7440-57-5 0.152 0.18 0.18 1836 1836 encapsulation organic material carbon black 1333-86-4 0.100 0.12 1203 plastics epoxy resin - 4.591 5.53 55342 inorganic material silicondioxide 60676-86-0 45.216 54.50 60.15 545000 601545 leadfinish non noble metal tin 7440-31-5 0.976 1.18 1.18 11765 11765 plating noble metal silver 7440-22-4 0.768 0.93 0.93 9252 9252 glue plastics epoxy resin - 0.164 0.20 1973 noble metal silver 7440-22-4 0.491 0.59 0.79 5919 7892 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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